VLSI INSIDEDie records,
with permission.
유료 teardown 이미지·보고서·주석을 복제하지 않습니다. 공개 또는 허가된 이미지가 없는 기록은 텍스트 상태로 남깁니다.
DIE
Die details undisclosed
No proprietary die image or paid teardown content is reproduced.
undisclosedDIERP1 · 20 mm² die
Official RP1 engineering article states a 20 mm² die area; no proprietary die image is reproduced.
officialDIEGH100 · 814 mm² · 80B transistors
NVIDIA states GH100's die size and transistor count.
officialDIEXCD ×8
AMD documentation lists eight XCDs, paired and 3D-stacked on IODs.
officialDIEIOD ×4
Four IODs form the base for paired 3D-stacked XCDs.
officialContributors must own or license uploaded microscopy and teardown images. Provenance and reuse terms are required before publication.